Category: Contactless Payments News

Texas Instruments’ Ultra-Thin Chip Module Enables Production of High-Quality Graphics-Rich Branded Contactless Cards

Thinnest module available allows use of more durable print stock and improves production yield DALLAS, May 5, 2008–Taking its cue from customers and a page out of the fashion magazines where “thin is always in,” Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the availability of its ultra-thin module for contactless payment applications which removes…

Building on its Transport Contactless Expertise, Gemalto Supports TIM’s Deployment of First NFC Program in Italy

In Trento, Telecom Italia Mobile subscribers have started using their mobile phone to easily take the bus Amsterdam, the Netherlands, May 27, 2008–Gemalto (Euronext NL0000400653 GTO), the world leader in digital security, today announced that it has been selected by TIM (Telecom Italia Mobile), the leading telecom operator in Italy, to support the launch of…

INSIDE Contactless continues expansion in Canadian Smart Card Market

EMV Migration Driving Demand for INSIDE’s MicroPass Contactless Payment Platform AIX-EN-PROVENCE, France, May 21, 2008–In a move to meet the growing demand for smart cards in Canada, INSIDE Contactless, the world leader in advanced contactless microprocessor platforms, today strengthened its position in the market and announced that it has joined Advanced Card Technologies (ACT) Canada….

Collis CPV Test Tool qualified by MasterCard

Leiden (NL) 6 May, 2008–Collis announces today that MasterCard has qualified Collis’ new MasterCard Card Personalisation Validation (CPV) module within the Collis EMV Personalisation Validation Tool (Collis EMV PVT). Professional testing of personalized MasterCard EMV/PayPass™ cards is essential to ensure worldwide accept- ance of cards. Collis’ newly developed module checks if MasterCard cards are correctly…

INSIDE Contactless Takes High-Profile Role at CTST 2008

Sponsorship, Trip Giveaway and Presentations Highlight Participation at Major Advanced Payment, Access Control, and Identification Event AIX-EN-PROVENCE, France, May 5, 2008–Reflecting its dominance in the industry, INSIDE Contactless, a leading provider of advanced, open-standard contactless chip technologies, today revealed details of its high-profile participation in the upcoming CTST Americas 2008 Conference & Exhibition taking place…

OTI’s Wholly Owned Subsidiary in Poland, ASEC, Wins Additional Award for Half a Million Multi-Application Contactless Cards from the City of Warsaw

Contactless Cards are Used for Public Transportation and Parking Solutions Fort Lee, NJ, May 5, 2008–On Track Innovations Ltd (OTI) (NASDAQ GM: OTIV), a global leader in contactless microprocessor-based smart card solutions for homeland security, payments, petroleum payments and other applications, today announced that its subsidiary, ASEC S.A. (“ASEC”) in Poland, will provide the Transport…

VeriFone Introduces Vx 810 DUET with Innovative Dual-User Design for Merchant and Customer Use

PCI PED and EMV-Approved System Combines Clerk and Customer-Facing Capabilities in a Sleek, Cost Effective, Feature-Rich Design LAS VEGAS (ETA Booth #519), April 15–VeriFone Holdings, Inc. (NYSE: PAY) today announced the Vx 810 DUET, a 2-in-1 payment system that incorporates a sleek and secure consumer-activated, hand-held device tethered to a clerk-facing base unit. The Vx…

INSIDE Ramps up Commitment to Transit Payment System Market

Contactless Payment Leader Joins American Public Transportation Association AIX-EN-PROVENCE, France, April 3, 2008–As transit agencies around the world move to modernize their automatic fare collection systems, INSIDE Contactless, a leading provider of advanced, open-standard contactless chip technologies, today announced it is bringing the power of its MicroPass® intelligent payment platform to the transit fare collection…

INSIDE Debuts New MicroPass Platform to Bring Contactless Applications to the Mainstream

MicroPass 4000 Product Suite Sets Stage to Extend Contactless Technology Beyond Payments AIX-EN-PROVENCE, France, March 10, 2008–INSIDE Contactless, a leading provider of advanced, open standard contactless chip technologies, today launched the MicroPass® 4000 contactless microprocessor family, a next-generation platform designed to bring a host of new contactless applications to mainstream markets in the U.S. and…

INSIDE Contactless supplies NFC chips for most of the trials under GSMA’s Pay-Buy-Mobile initiative

Major step towards a global interoperable mobile payments system January 29th 2008, Aix en Provence–Over the next few months, 12 mobile operators will run trials of contactless mobile payment services in Australia, France, Ireland, Korea, Malaysia, Norway, The Philippines, Singapore, Taiwan, Turkey and the U.S. as a precursor to commercial launches. The trials form part…