INSIDE Contactless Presents Next Generation NFC Services at 3GSM World Congress, Barcelona
Leading contactless technologies and partners enable unparalleled telecommunications services, demoed on booth F33, hall 2, 12-15 February, 2007
Barcelona, Spain, February 12th, 2007–INSIDE Contactless, a world leader for contactless semiconductor chips and hardware platforms, today announced that the company will present its next generation NFC (Near Field Communications) technologies and services on 3GSM booth number F33.
With over 10 years experience pioneering the emerging contactless payment market as a fabless semiconductor company, INSIDE Contactless currently holds more than 55 international patents, and manages a portfolio of 250 clients around the world. INSIDE Contactless is currently working on pilot projects in Europe and China, partnering with the largest digital security, banking, telecom and media businesses like, SFR, Credit Mutuel, NRJ Mobile, Sagem Monetel, Gemalto, Sagem Communication, MasterCard, and AIRTAG.
Further to access control and payment, NFC makes everyday life easier and 3GSM will be a major opportunity for the company to showcase latest NFC developments with applications in the telecom industry. INSIDE Contactless has managed to bring NFC to an unparalleled level of maturity, enabling chipset foundry, telecom operators, handset manufacturers and services companies to join efforts and offer secured, easy-to-use, mass market solutions.
At 3GSM, and together with AIRTAG, INSIDE Contactless will be demonstrating the direct integration of applications in the telephone’s SIM card. Combining standardized solutions with a high degree of security (NFC Forum specifications and Single Wire Protocol), INSIDE’s NFC enabled chipsets with AIRTAG SIM card embedded application and platform will enable mobile carrier to propose effective, flexible and secure relationship marketing application to main retailers (Loyalty, Couponing, Smart posters) and service companies (Ticketing).
“As in every emerging electronic market, IP is key for the success of company” says Philippe Martineau, Executive Vice President, NFC Business Line. “We have been working hard to offer best of breed, highly secured and very flexible technologies, and the current industry reactions leave us no doubt that the market will confirm a very quick take off. We anticipate that Telecom applications of NFC technology will be very large scale and diverse”.
Remy de Tonnac, CEO of INSIDE Contactless goes on to say: “INSIDE has always been a visionary company. We started working with Gemalto on a link between the NFC chip and the SIM card more than 2 years ago : it was called the Single Wire Protocol. Recently the industry has been taking the direction to adopt SWP as the preferred choice for a standard. This is a great recognition of our expertise in the field.”
3GSM will also be the time to showcase the “Contactless Travel Agency Showcase”. Developed in partnership with AIRTAG for SFR, the project features a smart poster application enabling end-users to download promotional offers on a private, mobile loyalty card. The voucher will then need to be redeemed on a NFC kiosk, enabling users to choose a destination, confirm the purchase and upload airline ticket directly on NFC mobile.
About INSIDE Contactless
Founded in 1995, INSIDE is headquartered in France and with global presence in China, Singapore, Poland and the USA. INSIDE is uniquely positioned as the only fabless semiconductor company solely dedicated to the advancement of contactless technology, leveraging one of the industry’s largest intellectual property portfolios. Through strategic emphasis in Contactless Payments and Near Field Communications (NFC), INSIDE has been on a rapid growth track over the past two years with more than 12M chips delivered for contactless payment cards in the US market and a dominant position in driving NFC standardization and pilot deployments. For more information, visit http://www.insidecontactless.com.