INSIDE’s recently announced partnership with Infineon and a strong involvement in the Smart Card Alliance place the company at the forefront of Contactless payment and NFC

INSIDE’s recently announced partnership with Infineon and a strong involvement in the Smart Card Alliance place the company at the forefront of Contactless payment and NFC

Aix en Provence, France, April 12, 2007–INSIDE Contactless, a leading provider of advanced, open standard contactless chip technologies, today announced that the company will present its next generation Payment and NFC (Near Field Communication) technologies and services at Cards Asia on booth 4H05, from 25 to 27 of April, 2007.

With over 10 years experience pioneering the emerging contactless market as a fabless semiconductor company, INSIDE currently holds more than 55 international patents, and manages a portfolio of 250 clients around the world. The company is currently working on multiple NFC pilot projects in Europe and Asia, partnering with the largest electronics, banking, telecom and media businesses.

INSIDE’s contactless payment core technology MicroPass® is based on an innovative chip architecture, and enables fast and reliable transactions, every time. MicroPass® is an ‘intelligent hardware platform’, with an optimized native operating system, application development tools, and enables deployment of multiple value-added applications alongside a core payment application.

Cards Asia will be a major opportunity for the company to showcase its latest technology and business developments with application for the payment industry. During the show, Charles Walton, Executive Vice President for the Payments will present a keynote conference on the topic: “Contactless Payments in Asia: Challenges for growth in the next wave”. The conference will be held at the Seminar Theatre, Hall 401, on Thursday, April 26 at 11.00 a.m.

“Asia is definitely a focus region for the coming year” says Goh Say Yeow, Executive Vice President of Sales and Managing Director of the Asia Pacific Region at INSIDE Contactless. “We’re really enthusiastic about the contactless payment market taking off in Asia, with the potential for dual interface EMV cards driving such growth. We are confident that the Asia-Pacific Region adoption of high-performance, lower cost dual interface cards later in 2007 and into 2008 will create an example for other EMV regions–demonstrating the speed, convenience, and security propositions of this new technology.

About INSIDE Contactless

Founded in 1995, INSIDE is headquartered in France and with global presence in China, Singapore, Poland and the USA. INSIDE is uniquely positioned as the only fabless semiconductor company solely dedicated to the advancement of contactless technology, leveraging one of the industry’s largest intellectual property portfolios. Through strategic emphasis in Contactless Payments and Near Field Communications (NFC), INSIDE has been on a rapid growth track over the past two years with more than 12M chips delivered for contactless payment cards in the US market and a dominant position in driving NFC standardization and pilot deployments. For more information, http://www.insidecontactless.com.

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