SESAMES Innovation Award for Best Hardware Delivered to INSIDE Contactless on the eve of the CARTES Tradeshow

SESAMES Innovation Award for Best Hardware Delivered to INSIDE Contactless on the eve of the CARTES Tradeshow

Market Leading MicroPass Intelligent Payment Platform Recognized as the Most Innovative Worldwide Contactless Payment Platform

Aix en Provence, November 13th, 2007–INSIDE Contactless, a leading provider of advanced, open standard contactless chip technologies, and the leader in NFC technology, today announced the company has been awarded the winners prize in the Hardware category at the twelfth SESAMES Innovation contest, on November 12th, 2007, on the eve of the Cartes trade show.

INSIDE Contactless was named SESAMES winner among more than 200 nominees in 10 categories for the MicroPass intelligent payment platform.

Awarded by a panel of more than thirty leading experts and journalists, the SESAME is testimonial to the innovative posture of INSIDE Contactless, with more than 55 patents granted, including several essential NFC technology patents, and more than 12 years experience in developing contactless chips. The award recognizes the development achievements of INSIDE in bringing to market the MicroPass L4 platform which was first launched at CARTES in 2005. Since that time, more than 35M MicroPass chips have been shipped to INSIDE’s card manufacturer partners for the benefit of issuers in the US, Canada, and other regions adopting contactless payments.

MicroPass is INSIDE’s next-generation microprocessor-based contactless payment platform, consisting of innovative chip hardware and an open & flexible operating system designed specifically to meet multi-payment brand and multi-application requirements. Featuring very low power consumption, MicroPass is the most reliable core platform available today for all kinds of devices, from key fobs to alternative form factor payment devices.

Rémy de Tonnac, CEO of INSIDE Contactless, commented: “We are proud that our MicroPass intelligent payment platform has been recognized as the leading hardware platform in the industry by the SESAMES jury members. Being rewarded for our innovation with MicroPass is a tremendous honor for us and our partners. This award demonstrates how contactless and NFC technology are going to change consumers’ daily lives”.

About MicroPass™

MicroPass is a family of intelligent hardware platforms designed to power open standard contactless and dual interface bank card payments in all global regions. Based upon a RISC architecture and optimized to the demanding requirements of contactless transactions, each of the MicroPass family of products feature low power consumption, fast transaction processing, and overall performance meeting the demands of issuer organizations in the bank card payments, transit, and access control markets. MicroPass is the platform of choice for card manufacturers and issuers in the US market with more than 35 million units shipped since launch in late 2005.

About INSIDE Contactless

As the only fabless semiconductor company focused exclusively upon contactless chip platforms, INSIDE Contactless is a market leader in Near Field Communication (NFC), contactless payments, and access control. Innovation in contactless technology has led to more than 55 patents granted to INSIDE, including several essential NFC technology patents.

INSIDE Contactless is the #1 market share provider of contactless bank card applications in the US, with more than 20 million MicroPass platforms powering cards from leading bank card issuers. More than 25 key partners around the world, including HID, Giesecke & Devrient and SAGEM, have successfully delivered contactless products such as payment & access cards, point of sale terminals, NFC enabled mobile handsets, and other products which are ‘powered by INSIDE’. INSIDE Contactless is headquartered in Aix-en-Provence, France, with offices in Shanghai, Singapore, Poland, San Francisco, and Boston.

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Elise Koenig
+33 1 41 06 18 07

Jean-Marie Amoros
+33 1 41 06 18 05