INSIDE Contactless and TIEMPO Announce Partnership on Next Generation Chip Product

INSIDE Contactless and TIEMPO Announce Partnership on Next Generation Chip Product

Experts in Contactless Hardware and Asynchronous Design To Collaborate on New Contactless Chip Platform

Aix en Provence, France, October 9th 2008–INSIDE Contactless, the world leader in advanced contactless microprocessor platforms, and TIEMPO, an innovative IP company specialized in the design of asynchronous ICs, have announced a partnership for the design of a next generation chip product that incorporates asynchronous design technology.

The new chip will be designed using TIEMPO clockless and delay insensitive technology. “TIEMPO technology enables the design of chips that have outstanding processing performance, low power consumption, low noise and robustness against voltage variations, and is therefore perfectly suited for use within INSIDE’s advanced contactless chip products”, says Serge Maginot, CEO of TIEMPO.

With the growth of contactless payment, transit, access and ID markets, and demands for faster, lower power, lower cost core technologies to support these markets, INSIDE is committed to an aggressive technology roadmap to drive new chip product launches. As the first step of this partnership, INSIDE and TIEMPO have engaged in a collaborative project that will include expert designers from both companies, TIEMPO providing INSIDE with its asynchronous IPs and with the expertise of its engineers in the design of low-power asynchronous chips.

“INSIDE is committed to use the most innovative design technologies for its advanced contactless chip platforms. We believe that the use of TIEMPO asynchronous design technology can provide significant gains in performance and reduction in power consumption within our products”, says Gary Chew, CTO of INSIDE Contactless.

About INSIDE Contactless

INSIDE Contactless is the global leader in next-generation, open-standard contactless payment and Near Field Communication (NFC) technologies. Based on 55 patents, the company’s microprocessor platforms uniquely integrate hardware and software on a single chip, enabling innovative contactless applications to be delivered through smart cards, mobile phones, and other consumer electronic devices. The company has delivered more than 250 million contactless platforms worldwide. INSIDE makes it easy and intuitive for consumers to pay for purchases and transportation; gain access to facilities; confirm their identities; and interact with smart posters. INSIDE is headquartered in Aix-en-Provence, France, with offices in Shanghai, Singapore, Warsaw, Seoul, and San Francisco. For more information, please visit


TIEMPO, located in Montbonnot, France, develops and commercializes a complete solution–Core IPs and EDA tools–for the design of innovative clockless integrated circuits that are ultra-low power, ultra-low noise, robust versus PVT variations and secured. TIEMPO portfolio of IPs today includes asynchronous cores of microcontrollers, microprocessors and crypto-processors. Targeted applications are embedded electronics (ultra-low power, low-power & high performances) and secured devices. For more information, please visit


For additional information:
Patrick Corman
Corman Communications, LLC
(650) 326-9648

INSIDE company contact:
Geraldine Sauniere-Miallet
Marcom Director
+33 (0) 4 42 39 33 01